Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. This integration significantly reduces the. As datacenters strive to meet escalating demands for efficiency and bandwidth, particularly with the integration of AI and ML technologies, optics is poised to play a crucial role in shaping the future of interconnect architecture and performance. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics. For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs. That playbook is no longer holding for today's AI systems. As for transmission quality, CPO addresses the problem of overloading.
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