JCET's 3D eWLB-SiP and eWLB-PoP solutions include embedded multiple passives and active components, face-to-back or face-to face options, and single-sided, 1. 5-sided and double-sided ultra-thin ...
Direct Manufacturer JCET also offers leading AIGC power-supply system packaging & testing solutions, plus comprehensive wide bandgap semiconductor processes from wafer thinning and backside metallization to Kelvin
Direct Manufacturer With the advent of 5G, these modules require higher power, operating frequencies, larger bandwidth, and smaller module sizes. JCET''s high-density heterogeneous integrated SiP solution
Direct Manufacturer JCET was formed in 1972, when Jiangyin converted a local factory to produce transistors. JCET went public on the Shanghai Stock Exchange in 2003 and continued to grow over time. JCET provides a
Direct Manufacturer Powerful RFFE modules by JCET Group. The Invisible Power Behind Your Mobile Experience π π± Behind every smartphone''s seamless connectivity lies its RF front-end module (RFFEM) β the
Direct Manufacturer Mr. Owen Jin, VP of JCET Group and General Manager of the AI & Smart Industry BU, stated: βThe transition from pluggable optical modules to highly integrated CPO devices brings
Direct Manufacturer JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration design, wafer
Direct Manufacturer Shanghai, China, January 21 β JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer samples of its silicon photonics engine developed on
Direct Manufacturer With decades of expertise in power device packaging and testing, JCET Group offers a comprehensive power product portfolio encompassing IGBT, SiC, GaN, and more. In the field of high-density power
Direct Manufacturer JCET''s dual-side SiP packaging technology supports placement accuracy up to 15 microns and components as small as 008004, significantly reducing module size. JCET also employs
Direct Manufacturer Shanghai, China, January 21, 2026 β JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer
Direct Manufacturer Through rigorous prototyping and empirical evaluation of test structures, JCET has verified the robust manufacturability and distinct performance advantages of constructing 3D IPDs on
Direct Manufacturer JCET Group is the world''s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and
Direct Manufacturer JCET''s 3D eWLB-SiP and eWLB-PoP solutions include embedded multiple passives and active components, face-to-back or face-to face options, and single-sided, 1.5-sided and double-sided ultra
Direct Manufacturer Founded in 1972, JCET Group is the world''s leading integrated circuit manufacturing and technology services provider. JCET is a global company that serves the world through our rich technology patent
Direct Manufacturer JCET Group is a publicly traded company headquartered in Jiangyin on China''s eastern coast. It is the largest Outsourced Semiconductor Assembly and Test (OSAT) company in mainland China and
Direct Manufacturer JCET Group | 1,902 followers on LinkedIn. Advanced and reliable semiconductor back-end manufacturing for a smarter world | JCET Group is the world''s leading
Direct Manufacturer JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient
Direct Manufacturer Driving the Future of Data Connectivity with Co-Packaged Optics (CPO) JCET''s latest CPO packaging solutions deliver higher bandwidth, lower power, and
Direct Manufacturer On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. Silicon
Direct Manufacturer In terms of high-density packaging and integration technology, JCET provides a number of industry-leading technologies including high-density mounting SMT capability, laser-assisted bonding (LAB),
Direct Manufacturer In power & energy applications, JCET develops AIGC and Communication base station power modules in close partnership with leading customers. We''re expanding capacity for mid-to-high-power devices
Direct Manufacturer By integrating optical engines with ASICs in a single package, we achieve shorter optical paths, optimized thermal management, and reliable system-level
Direct Manufacturer Mr. Owen Jin, VP of JCET Group and General Manager of the AI & Smart Industry BU, stated: βThe transition from pluggable optical modules to
Direct Manufacturer Founded in 1972, JCET Group is the world''s leading integrated circuit manufacturing and technology services provider. JCET is a global company that serves the world through our rich technology patent
Direct Manufacturer JCET Group has reported a remarkable growth in its 2025 Annual Report, achieving record-high revenue of RMB 38.87 billion and increased profitability, setting the stage for future advancements.
Direct Manufacturer JCET is also actively promoting the mass production applications of core materials such as ceramic substrates for new energy power module packaging (DBC/DBA/AMB), aluminum wire, aluminum
Direct Manufacturer The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider β including IC design and characterization, wafer bumping, packaging, test, and
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