JCET's 3D eWLB-SiP and eWLB-PoP solutions include embedded multiple passives and active components, face-to-back or face-to face options, and single-sided, 1. 5-sided and double-sided ultra-thin PoP configurations. September 1, 2025 -- In 2025, Co-Packaged Optics (CPO) technology has rapidly advanced toward commercialization. Global tech giants have launched CPO-based switch solutions to reduce energy consumption in data interconnects, while Chinese enterprises have made breakthroughs in integrated optical. On January 21, JCET announced a major breakthrough in its co-packaged optics (Co-Packaged Optics, CPO) technology development. Silicon photonics engine products based on its XDFOI® multidimensional heterogeneous advanced packaging platform have completed customer sample deliveries and successfully. Driving the Future of Data Connectivity with Co-Packaged Optics (CPO) JCET's latest CPO packaging solutions deliver higher bandwidth, lower power, and improved signal integrity — enabling next-generation performance for computing, communications, and automotive applications. By integrating optical. JCET Group is a publicly traded company headquartered in Jiangyin on China's eastern coast. JCET was formed in 1972, when Jiangyin converted a local factory to. JCET has been actively pushing the boundaries of traditional packaging paradigms by pioneering a number of enabling integration technologies in wafer level packaging, flip chip interconnect and Through Silicon Via (TSV) to develop differentiated solutions that position its customers for success in. April 17, 2026 -- JCET Group announced today the successful process validation of its wafer-level Radio Frequency (RF) Integrated Passive Devices (IPDs). This milestone was achieved using an advanced process integrating Through-Glass Via (TGV) structures with Photosensitive Polyimide (PSPI).
